METHOD FOR MANUFACTURING THE LIGHT EMITTING DEVICE PACKAGE

According to the present invention, a method for manufacturing a light emitting device package includes the steps of preparing a growth substrate having a plurality of light emitting devices formed on an upper surface thereof; preparing a first package substrate having a bonding pattern which is for...

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Bibliographische Detailangaben
Hauptverfasser:	SON, MYEONG RAK, LEE, SEUNG HWAN, CHO, MYONG SOO, SHIN, YOUNG CHUL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	According to the present invention, a method for manufacturing a light emitting device package includes the steps of preparing a growth substrate having a plurality of light emitting devices formed on an upper surface thereof; preparing a first package substrate having a bonding pattern which is formed on an upper side thereof and corresponds to some of the light emitting devices; bonding the light emitting devices and the bonding pattern after placing an upper surface of the growth substrate and an upper surface of the first package substrate to face each other; separating the light emitting devices from the growth substrate; and packaging the light emitting devices bonded to the bonding pattern.