HEAT DISSIPATING DEVICE AND PACKAGE FOR HEAT DISSIPATING USING THE SAME

Provided are a heat dissipation support plate and a heat dissipation package. A heat dissipation support plate includes a base part for supporting a heat source, a heat dissipation part which includes a porous fine structure part which is formed in the base part and transfers the heat of the heat source, and a phase change material which fills at least parts of the void of the porous fine structure, and a connection part which is formed in the base part for electrical wiring with the heat source. Therefore, a heat dissipation element, which comprises an open cell type porous fine structure part and the phase change material, provides a heat dissipation characteristic which prevents the overheat of the heat source by a high heat absorption capacity due to a phase change phenomenon.