METHOD FOR TREATING SUBSTRATE

The present invention in accordance with an embodiment of the present invention provides a substrate treating method which injects a chemical solution. In a method of treating a substrate with the chemical solution, a first chemical solution and a second chemical solution are simultaneously injected...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	NOH, HWAN IK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention in accordance with an embodiment of the present invention provides a substrate treating method which injects a chemical solution. In a method of treating a substrate with the chemical solution, a first chemical solution and a second chemical solution are simultaneously injected from a nozzle onto the substrate. One among the first chemical solution and the second chemical solution is injected in a mist form. The other is injected by a dropping method. One nozzle injects the first chemical solution and the second chemical solution with different methods and supplies the chemical solutions onto the substrate, thereby improving cleaning efficiency in a cleaning process.