MINIMIZATION METHOD OF POWER TSVS AND POWER BUMPS USING FLOORPLAN BLOCK PATTERN FOR 3D POWER DELIVERY NETWORK

The present invention relates to a method of minimizing the number of power through electrodes and the number of power bumps using power patterns in a 3D power supply network. The method includes the steps of: inserting power through electrodes or power bumps into initially set block arrangement by taking a voltage drop into consideration and storing the number of the power through electrodes and the number of the power bumps in the initially set block arrangement; setting a grid of a die; rearranging the blocks by taking the size of the blocks and the power consumption into consideration; calculating the voltage drop on a node of the die having the re-arranged blocks and inserting the power through electrodes or the power bumps until the calculated voltage drop values of all nodes are equal to or less than a threshold value; calculating the number of the power through electrodes and the number of the power bumps when the voltage drop values of all nodes are equal to or less than the threshold value and comparing the number of the power through electrodes and the number of the power bumps in the rearranged block with the number of the power through electrodes and the number of the power bumps in the previous block; and storing the results of the rearranged blocks when the number of the power through electrodes and the number of the power bumps in the rearranged block are less than those in the previous block and storing the results of the previous block when the number of the power through electrodes and the number of the power bumps in the rearranged block are equal to or greater than those in the previous block. The steps of setting a grid having a different size and storing the result of the block arrangement are repeated until the result of the block arrangement, in which the number of through electrodes and the number of power bumps are minimized, is deduced, thereby minimizing the number of the power through electrodes and the number of power bumps inserted in order to solve the problem related to the voltage drop without the increase of the size of a die in the 3D power supply network.