EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING THE SAME

An epoxy resin composition for encapsulating a semiconductor device of the present invention includes an epoxy resin, a curing agent, a curing accelerator, a coupling agent, and an inorganic filler. The coupling agent includes an alkylsilane compound represented by chemical formula 1. In chemical fo...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	BAE, KYOUNG CHUL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An epoxy resin composition for encapsulating a semiconductor device of the present invention includes an epoxy resin, a curing agent, a curing accelerator, a coupling agent, and an inorganic filler. The coupling agent includes an alkylsilane compound represented by chemical formula 1. In chemical formula 1, R1, R2 and R3 are independently an alkyl group having 1-4 carbon atoms, R is an alkyl group having 6-31 carbon atoms, and an average value of n is 1-5.