PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A printed circuit board according to an embodiment of the present invention includes a base substrate, a circuit pattern which is formed on the base substrate and a non-photosensitive insulating layer formed on the base substrate and protrudes from the non-photosensitive insulating layer, and a dam...

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Bibliographische Detailangaben
1. Verfasser:	HAZE TAKAYUKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A printed circuit board according to an embodiment of the present invention includes a base substrate, a circuit pattern which is formed on the base substrate and a non-photosensitive insulating layer formed on the base substrate and protrudes from the non-photosensitive insulating layer, and a dam which is made of a photosensitive material and is formed in the upper part of the non-photosensitive insulating layer outside of the base.