ELECTRONIC DEVICE MOUNTING APPARATUS AND METHOD FOR JUDGING POSITION THEREOF

Provided is electronic device mounting apparatus comprising: a bonding head which is a transferring unit for transferring electronic components through vacuum absorption and capable of elevating in Z axis direction and rotatable in θ direction with the Z axis as the center; a first transferring unit for transferring the bonding head toward Y axis vertical to the Z axis; a second transferring unit for transferring the first transferring unit toward X axis vertical to Z or Y axis; a position extraction device for extracting directional position of θ axis, Z axis of the bonding head, X axis of the second transferring unit, and Y axis of the first transferring unit; and a controlling unit for determining a position difference value at a targeted point of each axis and at a current point of the bonding head on the Z axis and θ axis, the location of the second transferring unit on the X axis, and the location of the first transferring unit on the Y axis extracted by the position extraction device. The controlling unit is capable of processing a work at a targeted point if the position difference value on each axis is in the preset range.