SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

A semiconductor module according to the present invention includes a heat transmission part which connects at least one among a control device, a buffer semiconductor device, and a memory device. The thermal conductivity of the heat transmission part can be higher than that of a substrate. When the...

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Hauptverfasser: BYUN, JAE BUM, KWAK, DONG OK, JEONG, JAE WOO, CHOI, JIN YOUNG, OH, JOON YOUNG, LEE, WON HWA, KIM, JUNG HOON, KANG, HEE YOUB
Format: Patent
Sprache:eng ; kor
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator BYUN, JAE BUM
KWAK, DONG OK
JEONG, JAE WOO
CHOI, JIN YOUNG
OH, JOON YOUNG
LEE, WON HWA
KIM, JUNG HOON
KANG, HEE YOUB
description A semiconductor module according to the present invention includes a heat transmission part which connects at least one among a control device, a buffer semiconductor device, and a memory device. The thermal conductivity of the heat transmission part can be higher than that of a substrate. When the semiconductor module is operated, the temperature of a connector can be lower than that of devices. Heat generated in the devices can be easily discharged to the connector through the heat transmission part. Therefore, the thermal performance and operation reliability of the semiconductor module can be improved.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR MODULE
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