SEMICONDUCTOR MODULE

A semiconductor module according to the present invention includes a heat transmission part which connects at least one among a control device, a buffer semiconductor device, and a memory device. The thermal conductivity of the heat transmission part can be higher than that of a substrate. When the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BYUN, JAE BUM, KWAK, DONG OK, JEONG, JAE WOO, CHOI, JIN YOUNG, OH, JOON YOUNG, LEE, WON HWA, KIM, JUNG HOON, KANG, HEE YOUB
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A semiconductor module according to the present invention includes a heat transmission part which connects at least one among a control device, a buffer semiconductor device, and a memory device. The thermal conductivity of the heat transmission part can be higher than that of a substrate. When the semiconductor module is operated, the temperature of a connector can be lower than that of devices. Heat generated in the devices can be easily discharged to the connector through the heat transmission part. Therefore, the thermal performance and operation reliability of the semiconductor module can be improved.