FILM PEELING DEVICE

The present invention relates to a film peeling device which can prevent fractured pieces of a film from being left on a substrate by preventing fracture of the film when the film is peeled off, even for a type of film which is easily broken such as dry-film type solder resist (DFSR). The film peeling device includes a substrate transport unit (1) transporting a substrate (2), and a peeling unit (30) peeling a film (2b) adhered to the substrate which is transported by the substrate transporting unit (1). The peeling unit (30) has unwinding and winding mechanisms (40, 50) for an adhesive sheet, an attaching mechanism (32) attaching the adhesive sheet (60) fed from the unwinding and winding mechanisms (40, 50) of the adhesive sheet onto the entire surface of the film (2b), and a peeling mechanism (32) peeling off the film (2b) adhered to the adhesive sheet (60) from the substrate (2) together with the adhesive sheet (60).