SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

The semiconductor package of an embodiment according to a technical idea of the present invention under the aim of achieving the technical project comprises a substrate; an electrode pattern arranged protruding the substrate; a wiring located on the bottom part of the substrate and electrically connected to the electrode pattern; a passivation layer which protects the wiring from external environments; a semiconductor chip which is electrically connected to the wiring; and a molding member which separates the passivation layer from the substrate. The semiconductor package of an embodiment according to a technical idea of the present invention under the aim of achieving the technical project comprises a substrate; an electrode pattern in which one side is arranged protruding the bottom surface of the substrate; a wiring located on the bottom part of the substrate and electrically connected to the electrode pattern; a passivation layer which protects the wiring from external environments; and a semiconductor chip located on a different surface in parallel with the bottom surface of the substrate and electrically connected to the wiring.