APPARATUS FOR SUBSTRATE

Provided is a substrate processing device. The substrate processing device includes a heating plate supporting a substrate; a heater disposed inside the heating plate and generating heat; and a cover unit covering the top surface of the heating plate. The cover unit includes a driving member moving...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NOH, HYOUNG RAE, LEE, SEUNG HAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided is a substrate processing device. The substrate processing device includes a heating plate supporting a substrate; a heater disposed inside the heating plate and generating heat; and a cover unit covering the top surface of the heating plate. The cover unit includes a driving member moving the cover to a process position and a standby position. The driving member includes a cylinder providing a space inside and has an opening at the top surface; a piston inserted into the opening; and a pressurizer moving the piston up and down by providing pressure to the space, wherein the piston is separated from the bottom surface of the cylinder when the cover is moved to the process position. Therefore, a gap between the cover and the heating plate can be minimized in a bake process.