APPARATUS FOR PROCESSING SUBSTRATE

The present invention relates to a device for processing a substrate to perform sputtering for both sides of a substrate. According to an embodiment of the present invention, the device for processing a substrate comprises a chamber with an evaporation space between a first circumferential surface having a first circumference and a second circumferential surface having a second circumference which is greater than the first circumference; a substrate drum on the evaporation space, on which substrates are mounted; a first target assembly to be joined to or detached from the first circumferential surface from the outside of the evaporation space to be positioned on the front side of the first target towards the evaporation space; a second target assembly to be joined to or detached from the second circumferential surface from the outside of the evaporation space to be positioned on the front side of the second target towards the evaporation space; and a substrate drum rotation shaft for rotating the substrate drum.