METAL-COMPOSITE BONDING APPARATUS

The present invention includes a pedestal (10) having the bottom surface; a press (20) which moves a preset metallic structure (100) from the upper side to a bonding position of the lower side to apply a bonding-pressing force; and a composite jig (70) formed on the pedestal (10) to fixate a composi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE, SE HWAN, HWANG, DONG KEE
Format: Patent
Sprache:eng ; kor
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention includes a pedestal (10) having the bottom surface; a press (20) which moves a preset metallic structure (100) from the upper side to a bonding position of the lower side to apply a bonding-pressing force; and a composite jig (70) formed on the pedestal (10) to fixate a composite (200) receiving the bonding-pressing force applied by the metallic structure (100). The present invention generates a pressing force using its own weight, prevents bonding defects of a metal and a composite by applying the pressing force with power, and remarkably improves the work convenience as matching the centers of the metallic structure (200) and the composite (200) is not strictly required in a bonding process. [Reference numerals] (AA) Side view in direction A