METAL-COMPOSITE BONDING APPARATUS
The present invention includes a pedestal (10) having the bottom surface; a press (20) which moves a preset metallic structure (100) from the upper side to a bonding position of the lower side to apply a bonding-pressing force; and a composite jig (70) formed on the pedestal (10) to fixate a composi...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | The present invention includes a pedestal (10) having the bottom surface; a press (20) which moves a preset metallic structure (100) from the upper side to a bonding position of the lower side to apply a bonding-pressing force; and a composite jig (70) formed on the pedestal (10) to fixate a composite (200) receiving the bonding-pressing force applied by the metallic structure (100). The present invention generates a pressing force using its own weight, prevents bonding defects of a metal and a composite by applying the pressing force with power, and remarkably improves the work convenience as matching the centers of the metallic structure (200) and the composite (200) is not strictly required in a bonding process. [Reference numerals] (AA) Side view in direction A |
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