PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

The present invention provides a prepreg, a copper clad laminate, and a printed circuit board. In the case of using a reinforcing base material comprised of prgamoc fibers composed of a liquid crystal polymer resin or a super engineering resin and a base resin having same components as the reinforci...

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Bibliographische Detailangaben
Hauptverfasser:	SOHN, KEUNG JIN, CHANG, TAE EUN, PARK, JUNG HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a prepreg, a copper clad laminate, and a printed circuit board. In the case of using a reinforcing base material comprised of prgamoc fibers composed of a liquid crystal polymer resin or a super engineering resin and a base resin having same components as the reinforcing base material according to the present invention, it is possible to adjust thermal expansion coefficient and rigidity, and solder joint reliability can be improved because degree of contraction and expansion of a semiconductor chip and a printed circuit board generated by heat during the operation of the semiconductor chip mounted on the printed circuit board become similar. During a via processing using a CO_2 laser drill, It prevents fiber projection thereby minimizing occurrence of defects of substrates.