EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME

An epoxy resin composition by an embodiment of the present invention contains an epoxy resin with a cyanide group (-CN), a hardener, and inorganic filler. A heating circuit board by an embodiment of the present invention includes a metal plate, an insulation layer formed on the metal plate, and a ci...

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Bibliographische Detailangaben
Hauptverfasser:	YUN, SUNG JIN, GIANG THANH KIEU, KIM, MYEONG JEONG, LEE, JONG SIK, GIL, GUN YOUNG, YOON, JONG HEUM, CHO, IN HEE, PARK, JAE MAN, LEE, HYUK SOO, KIM, JIN HWAN, PARK, JEUNG OOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	An epoxy resin composition by an embodiment of the present invention contains an epoxy resin with a cyanide group (-CN), a hardener, and inorganic filler. A heating circuit board by an embodiment of the present invention includes a metal plate, an insulation layer formed on the metal plate, and a circuit pattern formed on the insulation layer. The insulation layer is formed by hardening the epoxy resin composition which contains the epoxy resin with the cyanide group, the hardener, and the inorganic filler.