METAL HEAT-RADIATION SUBSTRATE AND MANUFACTURING METHOD THEREOF

The present invention relates to a metallic heat sink and a manufacturing method for the same. In accordance with an embodiment of the present invention, the metallic heat sink comprises a metallic board on which a through hole is formed; a heat resistance insulator which the through hole is charged...

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Bibliographische Detailangaben
Hauptverfasser:	SHIN, SANG HYUN, KANG, JOON SEOK, LEE, KWANG JIK, SHIN, HYE SUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a metallic heat sink and a manufacturing method for the same. In accordance with an embodiment of the present invention, the metallic heat sink comprises a metallic board on which a through hole is formed; a heat resistance insulator which the through hole is charged with and in which a via hole is formed in a charged part; a metal oxide film formed on the upper and lower surfaces of the metallic board except an inner wall having the through hole by being anodized; and a conductive layer formed on the metallic oxide film and filing the via hole.