MANUFACTURING METHOD OF DOUBLE SIDED M-CCL

The present invention relates to a method for manufacturing a double sided metal copper clad laminate comprising: a first step for forming a primary processing hole in a surface of an aluminum plate through a drill process; a second step for plugging the primary processing hole by penetrating a first and a second insulator into the primary processing hole while the first and the second insulator are hot pressed and attached to both sides of an aluminum plate after laying up the first and the second insulator, and a first and a second copper foil in both sides of the aluminum plate in order; a third step for forming an insulating component connected to the first and the second insulator by forming a secondary processing hole by drill processing the primary processing hole to maintain an insulating state of the aluminum plate; and a forth step for forming a plating layer for electrically connecting a first and a second copper plate in an inner peripheral surface of the secondary processing hole. According to the present invention, a double sided metal copper clad laminate (M-CCL) is manufactured by the following steps: a primary processing hole is formed in a surface of an aluminum plate; a first insulator and a second insulator are plugged to the primary processing hole; and a plating layer is formed in an inner peripheral surface of the secondary processing hole after forming a secondary processing hole. Through this, when a component such as a semiconductor is installed in the double sided metal copper clad laminate, a short circuit between the component and the aluminum plate inside the secondary processing hole can be prevented. [Reference numerals] (120, 130, AA, BB) Insulator