CUTTING METHOD OF LIGHT EMITTING ELEMENT PACKAGE WITH SILICON SUBSTRATE

According to one embodiment of the present invention, a method for cutting a light emitting diode package comprises the steps of: preparing a silicon substrate on which a plurality of light emitting diode chips are loaded on the surface thereof and a transparent material layer for covering the light emitting diode chips is formed; removing the transparent material layer between the light emitting diode chips along the cutting line by a mechanical cutting method; forming, on the silicon substrate, a scribing line corresponding to the cutting line by a laser processing method; and cutting the silicon substrate along the scribing line by applying mechanical impact to the silicon substrate so that the silicon substrate is divided into individual light emitting diode packages, thereby improving the productivity of the light emitting diode package cutting process and preventing the transparent material layer from being damaged or deformed.