FLUX

To provide flux which can suppress occurrence of the migration certainly on a soldered portion on which residue of flux is formed. In the flux which is mixed with solder powder to produce the solder paste, an amount of phosphoric acid ester, which is adsorbed to a surface of a soldered portion durin...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MINAKUCHI DAISUKE, SUGIURA TATSUYA
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide flux which can suppress occurrence of the migration certainly on a soldered portion on which residue of flux is formed. In the flux which is mixed with solder powder to produce the solder paste, an amount of phosphoric acid ester, which is adsorbed to a surface of a soldered portion during the soldering to form a film having hydrophobic quality is contained. It is preferable that an addition amount of phosphoric acid ester is not less than 1 mass% through less than 30 mass%. Further, it is preferable that the phosphoric acid ester is any one of (2-ethylhexyl) phosphate, monoisodecyl phosphate, monobutyl phosphate, dibutyl phosphate, monolauryl phosphate, monostearyl phosphate, monooleyl phosphate, tetracosyl phosphate or bis(2-ethylhexyl) phosphate.