CHIP PACKAGE AND MANUFACTURING METHOD THERFOR

A present invention provides a ship package and a manufacturing method thereof. The chip package comprises; a insulating layer in which a penetration hole is formed; a circuit pattern layer arranged on one side of the insulating layer; a heat radiation part which is arranged on the other side of the insulating layer and is made of a ceramic material; and a chip which is mounted on a portion of the heat radiation part exposed by the penetration hole. According to the present invention, the chip which is a heat source of the chip package directly mounts on the heat radiation part (260) which directly radiates heat and heat generated from the chip is effectively dissipated and the overheating, malfunction, and breakage of an LED chip and a semiconductor chip are prevented.