AG-BASED WIRE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

AG-BASED WIRE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

An Ag-based wire for a semiconductor package is provided. According to one embodiment of the present invention, the Ag-based wire for a semiconductor package comprises Au of 5-20 wt%, at least one among Ir, Pd, and Pt, an additive containing 0.5-5 wt%, and Ag.

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Bibliographische Detailangaben
Hauptverfasser: MOON, JEONG TAK, HONG, SUNG JAE, YOO, KYUNG AH, HEO, YOUNG IL
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An Ag-based wire for a semiconductor package is provided. According to one embodiment of the present invention, the Ag-based wire for a semiconductor package comprises Au of 5-20 wt%, at least one among Ir, Pd, and Pt, an additive containing 0.5-5 wt%, and Ag.