BONDING APPARATUS FOR FLEXIBLE DISPLAY PANEL

The present invention relates to a bonding apparatus for bonding a flexible display panel (FDP) and, especially, to a bonding apparatus with a wedge-shaped tool flatness adjusting device. The bonding apparatus comprises: a bonding module including a bonding tool and a heater block which has an insertion hole and a fastening means for attachment and detachment of the bonding tool in the lower part and has a heating means inside to indirectly transfer heat to the bonding tool; and a flatness adjusting block coupled to the bonding module and having an X-axis angle adjusting cut portion for X-axis angle adjustment of the bonding tool, an X-axis wedge insertion hole traversing the X-axis angle adjusting cut portion, a Y-axis angle adjusting cut portion for Y-axis angle adjustment of the bonding tool, a Y-axis wedge insertion hole traversing the Y-axis angle adjusting cut portion, and a fixing hole traversing the X, Y-axis angle adjusting cut portions and the X, Y-axis wedge insertion holes, including wedges which have through holes greater than the diameter of the fixing hole, are respectively inserted into the X, Y-axis wedge insertion holes such that the through holes are concentric with the fixing hole, and adjust a gap between the X, Y-axis angle adjusting cut portions while moving in the range of the inner diameter of the through holes, and a flat deformation fixing member which penetrates through the fixing hole and the through holes to fasten such that the X, Y-axis wedge insertion holes and the wedges come into close contact with each other, thereby fixing the wedges.