SUPPORT SUBSTRATE

This invention relates to a support substrate that is to be attached to a substrate to be supported to thereby support the substrate to be supported, including: a support substrate main body having an attachment surface that is to be attached to the substrate to be supported; and a conductive film m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NISHIHARA YOSHIYUKI, FURUKAWA KAZUYA
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	This invention relates to a support substrate that is to be attached to a substrate to be supported to thereby support the substrate to be supported, including: a support substrate main body having an attachment surface that is to be attached to the substrate to be supported; and a conductive film mainly including a fluorine-doped tin oxide, which has been formed on at least a surface opposite to the attachment surface among surfaces of the support substrate main body.