PRINTED CIRCUIT BOARD FOR SMART IC AND MANUFACTURING METHOD THEREFOR

The present invention provides a printed circuit board for a smart IC and a manufacturing method thereof. The printed circuit board for the smart IC includes: an insulation layer; an aluminum layer which is formed on one side of the insulation layer; and an adhesive layer which is located between th...

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Bibliographische Detailangaben
1. Verfasser: KANG, TEA HYUK
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention provides a printed circuit board for a smart IC and a manufacturing method thereof. The printed circuit board for the smart IC includes: an insulation layer; an aluminum layer which is formed on one side of the insulation layer; and an adhesive layer which is located between the insulation layer and the aluminum layer and attaches the aluminum layer to one side of the insulation layer. A plating layer is not required on a circuit pattern layer by directly bonding a wire to the circuit pattern layer by forming the circuit pattern layer with aluminum according to the present invention. A printed circuit board manufacturing process is simplified and resources for forming the plating layer are saved according to the present invention. Manufacturing costs are reduced.