PRINTED CIRCUIT BOARD FOR SMART IC AND MANUFACTURING METHOD THEREFOR

The present invention provides a printed circuit board for a smart IC and a manufacturing method thereof. The printed circuit board for the smart IC includes: an insulation layer; an aluminum layer which is formed on one side of the insulation layer; and an adhesive layer which is located between th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KANG, TEA HYUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a printed circuit board for a smart IC and a manufacturing method thereof. The printed circuit board for the smart IC includes: an insulation layer; an aluminum layer which is formed on one side of the insulation layer; and an adhesive layer which is located between the insulation layer and the aluminum layer and attaches the aluminum layer to one side of the insulation layer. A plating layer is not required on a circuit pattern layer by directly bonding a wire to the circuit pattern layer by forming the circuit pattern layer with aluminum according to the present invention. A printed circuit board manufacturing process is simplified and resources for forming the plating layer are saved according to the present invention. Manufacturing costs are reduced.