SILICON WAFER PEELING METHOD, AND SILICON WAFER PEELING APPARATUS

A method for peeling off silicon wafers is known such that the silicon wafers are peeled off from a beam one by one while by spraying hot wind in the air without rough-washing. However, even by a conventional method like this for peeling off silicon wafers, it is still not easy to efficiently peel o...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI MASAYUKI, FURUSHIGE TOORU, MATSUNO KOSO, YAMAMOTO YUJI, YOSHINO MICHIROU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	A method for peeling off silicon wafers is known such that the silicon wafers are peeled off from a beam one by one while by spraying hot wind in the air without rough-washing. However, even by a conventional method like this for peeling off silicon wafers, it is still not easy to efficiently peel off the silicon wafers from the beam one by one. A device for peeling off silicon wafers comprises: a heat insulator (3) for supporting a beam (2) to which silicon wafers are bonded via an adhesive; an induction heating coil (5) for heating the beam; a shifting mechanism (4) for shifting, in a horizontal direction, the heat insulator relatively with respect to the induction heating coil; an adsorption pad (6) for peeling off the silicon wafers one by one; and a container (7) for allowing the silicon wafers, the beam, and the heat insulator to soak in a liquid.