AN APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING

Disclosed is a device for heating a substrate during die bonding. The device comprises a substrate carrier, a heating device, a first actuator, and a second actuator. The substrate carrier maintains the substrate. The heating device heats the substrate. The first actuator performs movement between the substrate carrier and the heating device in order that the substrate is indexed to the heating device. The second actuator performs the movement between the substrate carrier and the heating device in order that the heating device heats different parts of the substrate. The second actuator separates the heating device from the substrate in order that the first actuator indexes the substrate across the heating device. Disclosed is a method for heating the substrate in the die bonding.