NANOIMPRINTING MOLD, METHOD OF MANUFACTURING THEREOF, AND NANOIMPRINTING METHOD

[Objective] To enable fluctuations in the thickness of resist films after imprinting to be eliminated, in a Nanoimprinting method that employs a fine pattern of protrusions and recesses. [Constitution] A nanoimprinting mold (10) is produced by forming a fine pattern of protrusions and recesses on th...

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Bibliographische Detailangaben
1. Verfasser:	SATOU NAOTOSHI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	[Objective] To enable fluctuations in the thickness of resist films after imprinting to be eliminated, in a Nanoimprinting method that employs a fine pattern of protrusions and recesses. [Constitution] A nanoimprinting mold (10) is produced by forming a fine pattern of protrusions and recesses on the surface of a substrate. A substrate (12) having a surface shape after a mold release process is administered thereon and before the pattern of protrusions and recesses is formed with a 3Ã value related to a height difference distribution within a range from 1nm to 3nm is employed as the substrate.