ELECTRONIC COMPONENT

The present invention provides an electronic component suppressing the formation of a crack on solder after embedded while suppressing a tilt of the component. A main body (12) includes a top surface (S5), a bottom surface (S6), sections (S3, S4), and sides (S1, S2). An external electrode (14a) is p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKEUCHI SYUNSUKE, OTA YUTAKA
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention provides an electronic component suppressing the formation of a crack on solder after embedded while suppressing a tilt of the component. A main body (12) includes a top surface (S5), a bottom surface (S6), sections (S3, S4), and sides (S1, S2). An external electrode (14a) is placed all over the bottom surface and on the sections and is not placed on the top surface, other sections and sides. An external electrode (14b) is placed all over the bottom surface and on one of the sections and is not placed on the top surface, other sections, and sides. The size of the area of a section part (30a) in the external electrode section and the size of the area of the other section part (30b) in the other section of the external electrode are 6.6% and 35.0% of the section and the other sections respectively.