CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

The present invention relates to a method for increasing the heat dissipation of a chip package. The present invention provides a chip package which comprises a circuit pattern; a chip mounting unit installed in a region in which the circuit pattern is formed; and a heat dissipation layer formed on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HWANG, GO EUN, PAIK, JEE HEUM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	The present invention relates to a method for increasing the heat dissipation of a chip package. The present invention provides a chip package which comprises a circuit pattern; a chip mounting unit installed in a region in which the circuit pattern is formed; and a heat dissipation layer formed on one surface of the circuit pattern, and a side surface of which is exposed by the chip mounting unit. [Reference numerals] (AA) Metal substrate