LED PAKAGE AND METHOD OF MANUFACTURING SAME
PURPOSE: An LED package and a method for manufacturing the same are provided to prevent the poor contact of a contact terminal by restraining the movement of a transparent resin leaked from the LED package. CONSTITUTION: An LED chip (110) is mounted on a printed circuit board. A contact terminal (13...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | PURPOSE: An LED package and a method for manufacturing the same are provided to prevent the poor contact of a contact terminal by restraining the movement of a transparent resin leaked from the LED package. CONSTITUTION: An LED chip (110) is mounted on a printed circuit board. A contact terminal (130) is electrically connected to the LED chip. A lens (150) is arranged on the upper part of the LED chip. The lens covers the LED chip. A resin blocking part (170) is formed on the upper surface of the printed circuit board. |
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