CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a s...

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Hauptverfasser: HORIUCHI FUMIO, INAGAKI YUHKI, KUDO KIYOAKI, SAKURAI AKIRA, MASHIMO SHIGEAKI
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Sprache:eng ; kor
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creator HORIUCHI FUMIO
INAGAKI YUHKI
KUDO KIYOAKI
SAKURAI AKIRA
MASHIMO SHIGEAKI
description PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20130102520A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20130102520A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20130102520A3</originalsourceid><addsrcrecordid>eNrjZDBz9gxyDvUMUXAMCHAMcgwJDVZw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBobGBoYGRqZGBo7GxKkCAKDcKIE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME</title><source>esp@cenet</source><creator>HORIUCHI FUMIO ; INAGAKI YUHKI ; KUDO KIYOAKI ; SAKURAI AKIRA ; MASHIMO SHIGEAKI</creator><creatorcontrib>HORIUCHI FUMIO ; INAGAKI YUHKI ; KUDO KIYOAKI ; SAKURAI AKIRA ; MASHIMO SHIGEAKI</creatorcontrib><description>PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130917&amp;DB=EPODOC&amp;CC=KR&amp;NR=20130102520A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130917&amp;DB=EPODOC&amp;CC=KR&amp;NR=20130102520A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HORIUCHI FUMIO</creatorcontrib><creatorcontrib>INAGAKI YUHKI</creatorcontrib><creatorcontrib>KUDO KIYOAKI</creatorcontrib><creatorcontrib>SAKURAI AKIRA</creatorcontrib><creatorcontrib>MASHIMO SHIGEAKI</creatorcontrib><title>CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME</title><description>PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBz9gxyDvUMUXAMCHAMcgwJDVZw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBobGBoYGRqZGBo7GxKkCAKDcKIE</recordid><startdate>20130917</startdate><enddate>20130917</enddate><creator>HORIUCHI FUMIO</creator><creator>INAGAKI YUHKI</creator><creator>KUDO KIYOAKI</creator><creator>SAKURAI AKIRA</creator><creator>MASHIMO SHIGEAKI</creator><scope>EVB</scope></search><sort><creationdate>20130917</creationdate><title>CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME</title><author>HORIUCHI FUMIO ; INAGAKI YUHKI ; KUDO KIYOAKI ; SAKURAI AKIRA ; MASHIMO SHIGEAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20130102520A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HORIUCHI FUMIO</creatorcontrib><creatorcontrib>INAGAKI YUHKI</creatorcontrib><creatorcontrib>KUDO KIYOAKI</creatorcontrib><creatorcontrib>SAKURAI AKIRA</creatorcontrib><creatorcontrib>MASHIMO SHIGEAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HORIUCHI FUMIO</au><au>INAGAKI YUHKI</au><au>KUDO KIYOAKI</au><au>SAKURAI AKIRA</au><au>MASHIMO SHIGEAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME</title><date>2013-09-17</date><risdate>2013</risdate><abstract>PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME
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