CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME
PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a s...
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creator | HORIUCHI FUMIO INAGAKI YUHKI KUDO KIYOAKI SAKURAI AKIRA MASHIMO SHIGEAKI |
description | PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20130102520A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20130102520A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20130102520A3</originalsourceid><addsrcrecordid>eNrjZDBz9gxyDvUMUXAMCHAMcgwJDVZw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBobGBoYGRqZGBo7GxKkCAKDcKIE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME</title><source>esp@cenet</source><creator>HORIUCHI FUMIO ; INAGAKI YUHKI ; KUDO KIYOAKI ; SAKURAI AKIRA ; MASHIMO SHIGEAKI</creator><creatorcontrib>HORIUCHI FUMIO ; INAGAKI YUHKI ; KUDO KIYOAKI ; SAKURAI AKIRA ; MASHIMO SHIGEAKI</creatorcontrib><description>PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130917&DB=EPODOC&CC=KR&NR=20130102520A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130917&DB=EPODOC&CC=KR&NR=20130102520A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HORIUCHI FUMIO</creatorcontrib><creatorcontrib>INAGAKI YUHKI</creatorcontrib><creatorcontrib>KUDO KIYOAKI</creatorcontrib><creatorcontrib>SAKURAI AKIRA</creatorcontrib><creatorcontrib>MASHIMO SHIGEAKI</creatorcontrib><title>CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME</title><description>PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBz9gxyDvUMUXAMCHAMcgwJDVZw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBobGBoYGRqZGBo7GxKkCAKDcKIE</recordid><startdate>20130917</startdate><enddate>20130917</enddate><creator>HORIUCHI FUMIO</creator><creator>INAGAKI YUHKI</creator><creator>KUDO KIYOAKI</creator><creator>SAKURAI AKIRA</creator><creator>MASHIMO SHIGEAKI</creator><scope>EVB</scope></search><sort><creationdate>20130917</creationdate><title>CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME</title><author>HORIUCHI FUMIO ; INAGAKI YUHKI ; KUDO KIYOAKI ; SAKURAI AKIRA ; MASHIMO SHIGEAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20130102520A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HORIUCHI FUMIO</creatorcontrib><creatorcontrib>INAGAKI YUHKI</creatorcontrib><creatorcontrib>KUDO KIYOAKI</creatorcontrib><creatorcontrib>SAKURAI AKIRA</creatorcontrib><creatorcontrib>MASHIMO SHIGEAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HORIUCHI FUMIO</au><au>INAGAKI YUHKI</au><au>KUDO KIYOAKI</au><au>SAKURAI AKIRA</au><au>MASHIMO SHIGEAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME</title><date>2013-09-17</date><risdate>2013</risdate><abstract>PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME |
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