CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent a connection unit which is composed of fine metal wires from being shorted by connecting a circuit element mounted on an island part to a bonding part via the connection unit. CONSTITUTION: A first lead (18) and a second lead (20) are fixed to the upper surface of a circuit board (12). The first lead includes an island part (28), a slope part (30), and a lead part (32). A transistor (22) and a diode (24) are mounted on the upper surface of the island part. An electrode which is formed on the upper surfaces of the diode and the transistor is connected to a bonding part (34) via a fine metal wire (26). The bonding part of the first lead is arranged to be higher than the island part. [Reference numerals] (10) Hybrid integrated circuit device; (12) Circuit board; (16) Sealing resin; (18,20) Lead; (22) Transistor; (24) Diode; (26) Metal wire; (28) Island part; (30,39) Slope part; (32,38) Lead part; (34,36) Bonding part