HEAT RESISTANT ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME

PURPOSE: A heat resistant adhesive tape and a semiconductor device using the same are provided to suppress delamination on an interface between an epoxy molding compound and a tape. CONSTITUTION: Heat resistant adhesive layers (20) are formed on both sides of a heat resistant film (10). The heat res...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, YEON SOO, HWANG, NAM ICK, MOON, KI JEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE: A heat resistant adhesive tape and a semiconductor device using the same are provided to suppress delamination on an interface between an epoxy molding compound and a tape. CONSTITUTION: Heat resistant adhesive layers (20) are formed on both sides of a heat resistant film (10). The heat resistant adhesive layer includes a polyamide resin made of aromatic tetracarboxylic acid and diamine. The diamine of the polyamide resin includes aromatic diamine and siloxane diamine. The siloxane diamine is 40 to 60 mol% of the diamine. The remaining solvent of the polyamide resin is 1 wt% or less.