TAPE FILM PACKAGE AND MANUFACTURING METHOD OF THE SAME

PURPOSE: Tape film package and manufacturing method thereof are provided to increase the production yield by preventing or minimizing generation of metal particles. CONSTITUTION: A via contact (40) penetrates an insulation film (10). First wire patterns (30) are extended from the via contact to a cr...

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Bibliographische Detailangaben
Hauptverfasser:	KWON, YOUNG SHIN, HAN, SANG UK, LEE, KWAN JAI, CHO, KYONG SOON, JUNG, JAE MIN, HA, JEONG KYU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PURPOSE: Tape film package and manufacturing method thereof are provided to increase the production yield by preventing or minimizing generation of metal particles. CONSTITUTION: A via contact (40) penetrates an insulation film (10). First wire patterns (30) are extended from the via contact to a cross section of the insulation film. Second wire patterns (50) are connected to the via contact below the insulation film, are parallel with the first wire patterns and are spaced apart from the cross section of the insulation film. A second solder resist (52) covers a part of the second wire patterns. The second solder resist is arranged below the insulation film between the second wire patterns and cross section.