VACUUM DEPOSITION APPARATUS

PURPOSE: A vacuum deposition apparatus is provided to uniformly form films on base members and to reduce maintenance frequency by controlling an amount of the films attached on the end of rolls. CONSTITUTION: A vacuum deposition apparatus comprises a vacuum chamber (4), deposition rolls (2), magneti...

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Bibliographische Detailangaben
Hauptverfasser:	OKIMOTO TADAO, TAMAGAKI HIROSHI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE: A vacuum deposition apparatus is provided to uniformly form films on base members and to reduce maintenance frequency by controlling an amount of the films attached on the end of rolls. CONSTITUTION: A vacuum deposition apparatus comprises a vacuum chamber (4), deposition rolls (2), magnetic field generating parts (8), gas supply parts (7), and a power source. Each magnetic field generating part comprises an inner magnet and an outer magnet. The inner magnet is laterally smaller than the deposition roll on which a base member is wound, and is arranged within a range where the base member is wound. [Reference numerals] (6) Plasma power source; (9) Vacuum pump