LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING MODULE

LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING MODULE

PURPOSE: A light emitting device, a light emitting device package, and a light emitting module are provided to reduce manufacturing processes by supplying the light emitting device packaged with a wafer level to remove a packaging process. CONSTITUTION: A light emitting structure (120) includes a fi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHOI, HEE SEOK, HAN, YOUNG JU, KANG, PIL GEUN, HWANG, DEOK KI, BAE, SEOK HUN, CHOI, SEOK BEOM
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A light emitting device, a light emitting device package, and a light emitting module are provided to reduce manufacturing processes by supplying the light emitting device packaged with a wafer level to remove a packaging process. CONSTITUTION: A light emitting structure (120) includes a first conductive semiconductor layer (115), a second conductive semiconductor layer (119), and an active layer (117). A reflection electrode layer (130) is formed on the lower side of the second conductive semiconductor layer. A first electrode structure is formed on the lower side of the first conductive semiconductor layer. A second electrode structure is formed on the lower side of the reflection electrode layer. A plurality of insulation layers are formed among the light emitting structure, the first electrode structure, and the second electrode structure.