METHOD OF BONDING A DIE ON A SUBSTRATE AND APPARATUS FOR BONDING A DIE ON A SUBSTRATE

METHOD OF BONDING A DIE ON A SUBSTRATE AND APPARATUS FOR BONDING A DIE ON A SUBSTRATE

PURPOSE: A method and an apparatus for bonding a die on a substrate are provided to perform a bonding process on a wafer having two kinds of dies in one place and to reduce the time for manufacturing a semiconductor device. CONSTITUTION: A die ejector (120) is arranged beneath a stage unit. A die pi...

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Bibliographische Detailangaben
1. Verfasser: MUN, GANG HYUN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A method and an apparatus for bonding a die on a substrate are provided to perform a bonding process on a wafer having two kinds of dies in one place and to reduce the time for manufacturing a semiconductor device. CONSTITUTION: A die ejector (120) is arranged beneath a stage unit. A die picker (130) is arranged in the upper part of the stage unit. A temporary support unit (140) is adjacent to the stage unit. A transfer unit (151) is arranged at both sides of the stage unit. A bonding head unit bonds the die to a substrate.