POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

PURPOSE: A positive photosensitive resin composition is provided to be able to show an excellent cyclization rate by a low temperature curing reaction, and, therefore, to be able to manufacture a photosensitive resin film with an excellent mechanical property and insulation property. CONSTITUTION: A...

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Bibliographische Detailangaben
Hauptverfasser:	HWANG, EUN HA, LEE, JIN YOUNG, KIM, SANG KYEON, LEE, JUN HO, CHO, HYUN YONG, KWON, JI YUN, KIM, SANG SOO, LEE, JONG HWA, KIM, DAE YUN, YOON, EUN KYUNG, HONG, CHUNG BEOM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	PURPOSE: A positive photosensitive resin composition is provided to be able to show an excellent cyclization rate by a low temperature curing reaction, and, therefore, to be able to manufacture a photosensitive resin film with an excellent mechanical property and insulation property. CONSTITUTION: A positive photosensitive resin composition comprises (A) alkali soluble resin selected from a polybenzoxazole precursor, and a polyimide precursor or their combination; (B) a photosensitive diazoquinone compound; (B) a thermoacid generator with a decomposition temperature of 150-200deg.C; and (D) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical formula 1, or both repeating units of Chemical formulas 1 and 2, and has a thermally polymerizable functional group on at least one terminal end.