APPARATUS TO SPUTTER
PURPOSE: A sputter apparatus is provided to cool a target by using a target cooling unit that cooling water is circulated in the heat pipe module which is installed in a cathode backing tube, or the cathode backing tube, thereby applying the high power. CONSTITUTION: A sputter apparatus includes a c...
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| creator | SHIN, SANG HO KIM, YOUNG TAE CHOI, GO BONG KIM, YOUNG MIN SHIN, SUNG DUCK LEE, CHOON SOO |
| description | PURPOSE: A sputter apparatus is provided to cool a target by using a target cooling unit that cooling water is circulated in the heat pipe module which is installed in a cathode backing tube, or the cathode backing tube, thereby applying the high power. CONSTITUTION: A sputter apparatus includes a chamber (100), a rotary cathode (300), and a heat pipe module. The chamber has a deposition space for a substrate. The rotary cathode is rotatably provided in the chamber, and includes a target (310), which provides a deposition material to the substrate, and a cathode backing tube (320) which has the target on the outer wall thereof. The heat pipe module is provided in the cathode backing tube, and cools the target. |
| format | Patent |
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CONSTITUTION: A sputter apparatus includes a chamber (100), a rotary cathode (300), and a heat pipe module. The chamber has a deposition space for a substrate. The rotary cathode is rotatably provided in the chamber, and includes a target (310), which provides a deposition material to the substrate, and a cathode backing tube (320) which has the target on the outer wall thereof. The heat pipe module is provided in the cathode backing tube, and cools the target.</description><language>eng ; kor</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130710&DB=EPODOC&CC=KR&NR=20130078370A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130710&DB=EPODOC&CC=KR&NR=20130078370A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIN, SANG HO</creatorcontrib><creatorcontrib>KIM, YOUNG TAE</creatorcontrib><creatorcontrib>CHOI, GO BONG</creatorcontrib><creatorcontrib>KIM, YOUNG MIN</creatorcontrib><creatorcontrib>SHIN, SUNG DUCK</creatorcontrib><creatorcontrib>LEE, CHOON SOO</creatorcontrib><title>APPARATUS TO SPUTTER</title><description>PURPOSE: A sputter apparatus is provided to cool a target by using a target cooling unit that cooling water is circulated in the heat pipe module which is installed in a cathode backing tube, or the cathode backing tube, thereby applying the high power. 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CONSTITUTION: A sputter apparatus includes a chamber (100), a rotary cathode (300), and a heat pipe module. The chamber has a deposition space for a substrate. The rotary cathode is rotatably provided in the chamber, and includes a target (310), which provides a deposition material to the substrate, and a cathode backing tube (320) which has the target on the outer wall thereof. The heat pipe module is provided in the cathode backing tube, and cools the target.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | APPARATUS TO SPUTTER |
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