APPARATUS TO SPUTTER

PURPOSE: A sputter apparatus is provided to cool a target by using a target cooling unit that cooling water is circulated in the heat pipe module which is installed in a cathode backing tube, or the cathode backing tube, thereby applying the high power. CONSTITUTION: A sputter apparatus includes a c...

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Bibliographische Detailangaben
Hauptverfasser:	SHIN, SANG HO, KIM, YOUNG TAE, CHOI, GO BONG, KIM, YOUNG MIN, SHIN, SUNG DUCK, LEE, CHOON SOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE: A sputter apparatus is provided to cool a target by using a target cooling unit that cooling water is circulated in the heat pipe module which is installed in a cathode backing tube, or the cathode backing tube, thereby applying the high power. CONSTITUTION: A sputter apparatus includes a chamber (100), a rotary cathode (300), and a heat pipe module. The chamber has a deposition space for a substrate. The rotary cathode is rotatably provided in the chamber, and includes a target (310), which provides a deposition material to the substrate, and a cathode backing tube (320) which has the target on the outer wall thereof. The heat pipe module is provided in the cathode backing tube, and cools the target.