A FILM FORMING APPARATUS AND A PLATE FOR CAPTURING PARTICLES
PURPOSE: A film forming apparatus and a particle capturing plate are provided to effectively prevent the exfoliation of a sedimentary film and to effectively capture film forming materials by forming uneven portions on the surface of the particle capturing plate. CONSTITUTION: A film forming apparat...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | IIO ITSUSHI SUZUKI ATSUNORI |
description | PURPOSE: A film forming apparatus and a particle capturing plate are provided to effectively prevent the exfoliation of a sedimentary film and to effectively capture film forming materials by forming uneven portions on the surface of the particle capturing plate. CONSTITUTION: A film forming apparatus comprises a film forming chamber for coating film forming materials on a target film forming member. The film forming chamber has a particle capturing plate. First and second uneven portions (32,34) are formed on the surface of the particle capturing plate. The second uneven portions are formed on the first uneven portions and are minuter than the first uneven portions. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20130075639A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20130075639A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20130075639A3</originalsourceid><addsrcrecordid>eNrjZLBxVHDz9PFVcPMP8vX0c1dwDAhwDHIMCQ1WcPRzUXBUCPBxDHEFySo4OwaEhAaB1ABVhHg6-7gG8zCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwNDYwMDc1MzY0tHY-JUAQB2-CoY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>A FILM FORMING APPARATUS AND A PLATE FOR CAPTURING PARTICLES</title><source>esp@cenet</source><creator>IIO ITSUSHI ; SUZUKI ATSUNORI</creator><creatorcontrib>IIO ITSUSHI ; SUZUKI ATSUNORI</creatorcontrib><description>PURPOSE: A film forming apparatus and a particle capturing plate are provided to effectively prevent the exfoliation of a sedimentary film and to effectively capture film forming materials by forming uneven portions on the surface of the particle capturing plate. CONSTITUTION: A film forming apparatus comprises a film forming chamber for coating film forming materials on a target film forming member. The film forming chamber has a particle capturing plate. First and second uneven portions (32,34) are formed on the surface of the particle capturing plate. The second uneven portions are formed on the first uneven portions and are minuter than the first uneven portions.</description><language>eng ; kor</language><subject>ALLOYS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; FERROUS OR NON-FERROUS ALLOYS ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130705&DB=EPODOC&CC=KR&NR=20130075639A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130705&DB=EPODOC&CC=KR&NR=20130075639A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IIO ITSUSHI</creatorcontrib><creatorcontrib>SUZUKI ATSUNORI</creatorcontrib><title>A FILM FORMING APPARATUS AND A PLATE FOR CAPTURING PARTICLES</title><description>PURPOSE: A film forming apparatus and a particle capturing plate are provided to effectively prevent the exfoliation of a sedimentary film and to effectively capture film forming materials by forming uneven portions on the surface of the particle capturing plate. CONSTITUTION: A film forming apparatus comprises a film forming chamber for coating film forming materials on a target film forming member. The film forming chamber has a particle capturing plate. First and second uneven portions (32,34) are formed on the surface of the particle capturing plate. The second uneven portions are formed on the first uneven portions and are minuter than the first uneven portions.</description><subject>ALLOYS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxVHDz9PFVcPMP8vX0c1dwDAhwDHIMCQ1WcPRzUXBUCPBxDHEFySo4OwaEhAaB1ABVhHg6-7gG8zCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwNDYwMDc1MzY0tHY-JUAQB2-CoY</recordid><startdate>20130705</startdate><enddate>20130705</enddate><creator>IIO ITSUSHI</creator><creator>SUZUKI ATSUNORI</creator><scope>EVB</scope></search><sort><creationdate>20130705</creationdate><title>A FILM FORMING APPARATUS AND A PLATE FOR CAPTURING PARTICLES</title><author>IIO ITSUSHI ; SUZUKI ATSUNORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20130075639A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2013</creationdate><topic>ALLOYS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>IIO ITSUSHI</creatorcontrib><creatorcontrib>SUZUKI ATSUNORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IIO ITSUSHI</au><au>SUZUKI ATSUNORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A FILM FORMING APPARATUS AND A PLATE FOR CAPTURING PARTICLES</title><date>2013-07-05</date><risdate>2013</risdate><abstract>PURPOSE: A film forming apparatus and a particle capturing plate are provided to effectively prevent the exfoliation of a sedimentary film and to effectively capture film forming materials by forming uneven portions on the surface of the particle capturing plate. CONSTITUTION: A film forming apparatus comprises a film forming chamber for coating film forming materials on a target film forming member. The film forming chamber has a particle capturing plate. First and second uneven portions (32,34) are formed on the surface of the particle capturing plate. The second uneven portions are formed on the first uneven portions and are minuter than the first uneven portions.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; kor |
recordid | cdi_epo_espacenet_KR20130075639A |
source | esp@cenet |
subjects | ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS |
title | A FILM FORMING APPARATUS AND A PLATE FOR CAPTURING PARTICLES |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T07%3A16%3A12IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IIO%20ITSUSHI&rft.date=2013-07-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20130075639A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |