A FILM FORMING APPARATUS AND A PLATE FOR CAPTURING PARTICLES

PURPOSE: A film forming apparatus and a particle capturing plate are provided to effectively prevent the exfoliation of a sedimentary film and to effectively capture film forming materials by forming uneven portions on the surface of the particle capturing plate. CONSTITUTION: A film forming apparat...

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Bibliographische Detailangaben
Hauptverfasser:	IIO ITSUSHI, SUZUKI ATSUNORI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PURPOSE: A film forming apparatus and a particle capturing plate are provided to effectively prevent the exfoliation of a sedimentary film and to effectively capture film forming materials by forming uneven portions on the surface of the particle capturing plate. CONSTITUTION: A film forming apparatus comprises a film forming chamber for coating film forming materials on a target film forming member. The film forming chamber has a particle capturing plate. First and second uneven portions (32,34) are formed on the surface of the particle capturing plate. The second uneven portions are formed on the first uneven portions and are minuter than the first uneven portions.