SUBSTRATE PROCESSING METHOD

PURPOSE: A substrate processing method is provided to reduce maintenance and repair costs by discharging liquefied materials remaining in a vaporizer with a simple method to control the sequence of a valve without changing a structure of an apparatus. CONSTITUTION: The discharge of raw materials is...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JUNG LAE, NA, HUN HEE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE: A substrate processing method is provided to reduce maintenance and repair costs by discharging liquefied materials remaining in a vaporizer with a simple method to control the sequence of a valve without changing a structure of an apparatus. CONSTITUTION: The discharge of raw materials is blocked by closing a fourth valve (S110). The inflow of the raw materials is blocked by closing a sixth valve (S112). A seventh valve is closed (S114). A fifth valve is closed (S116). The residue of a vaporizer is discharged by opening the seventh valve (S117). An eighth valve is closed (S118). Delay time for one to five seconds is given (S120). A first valve, a second valve, and a third valve are simultaneously closed (S122). [Reference numerals] (AA) Vaporization of liquid material is blocked; (BB) Vaporizer is pressurized; (CC) Carrier gas is blocked; (S110) Discharge of raw materials is blocked by closing a V4; (S112) Inflow of the raw materials is blocked by closing a V6; (S114) V7 is closed; (S116) V5 is closed; (S117) Residue of a vaporizer is discharged by opening a V7; (S118) V8 is closed; (S120) Preset time delay; (S122) V1, a V2, and a V3 are simultaneously closed