MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

PURPOSE: A method for manufacturing a printed circuit board is provided to instantly form a circuit pattern using a mask with an etching process without an exposure and a development process in order to simplify manufacturing processes, thereby reducing costs and time for the manufacturing processes...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM, HYE JIN, HWANG, JAE WOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing a printed circuit board is provided to instantly form a circuit pattern using a mask with an etching process without an exposure and a development process in order to simplify manufacturing processes, thereby reducing costs and time for the manufacturing processes. CONSTITUTION: A method for manufacturing a printed circuit board includes the following steps: a step of preparing a base substrate(110); a step of forming a conductive layer(120) on the base substrate; a step of forming a mask(130), on which a circuit pattern non-formed region is opened excluding a circuit pattern formed region, on the conductive layer; and a step of spraying an etching solution on the opened circuit pattern non-formed region in order to print a circuit pattern(20).