METHOD FOR ADHERING WORKS AND WORK ADHERING APPARATUS

PURPOSE: A method for adhering works and a work adhering apparatus are provided to uniformly maintain the thickness of a work by using a press head for pressurizing a plate with constant pressure. CONSTITUTION: A first stage(12) includes a heating table(14). A plate(22) for adhering a work is mounte...

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Bibliographische Detailangaben
Hauptverfasser:	OBUSE ATSUSHI, TERASAWA MITSUKO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE: A method for adhering works and a work adhering apparatus are provided to uniformly maintain the thickness of a work by using a press head for pressurizing a plate with constant pressure. CONSTITUTION: A first stage(12) includes a heating table(14). A plate(22) for adhering a work is mounted on the heating table. A position determination cylinder(24) has three position pins(25) connected to a load. Three through holes corresponding to the position pins are formed in the plate. An infrared temperature sensor(28) detects the surface temperature of the plate on the heating table.