THE LIGHT EMITTING DEVICE PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

THE LIGHT EMITTING DEVICE PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

PURPOSE: A light emitting device package and a method for manufacturing the same are provided to prevent the generation of voids between a substrate and a light emitting structure, and the damage of the substrate due to shrinkage in a ceramic sintering process. CONSTITUTION: A light emitting structu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HAN, YOUNG JU, HWANG, DEOK KI, BAE, SEOK HUN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A light emitting device package and a method for manufacturing the same are provided to prevent the generation of voids between a substrate and a light emitting structure, and the damage of the substrate due to shrinkage in a ceramic sintering process. CONSTITUTION: A light emitting structure(50) includes a first conductive semiconductor layer(120), an active layer(130), and a second conductive semiconductor layer(140). A device pad(160) is formed in the upper part of the light emitting structure. A metal protrusion(180) is formed on the device pad. The metal protrusion includes a metal with a low coefficient of thermal expansion. An insulating layer(185) covers the lower part of the light emitting structure.