A METHOD OF PLASTIC BOARD WITH ULTRA-LIGHTWEIGHT

PURPOSE: A method for manufacturing an ultra-lightweight plastic board is provided to maintain rigidity, obtain shock resistance, and easily maintained and repaired. CONSTITUTION: A method for manufacturing an ultra-lightweight plastic board comprises: a step of coating resin(30) with 3-18mm to wove...

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Bibliographische Detailangaben
1. Verfasser:	AHN, HEE CHAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing an ultra-lightweight plastic board is provided to maintain rigidity, obtain shock resistance, and easily maintained and repaired. CONSTITUTION: A method for manufacturing an ultra-lightweight plastic board comprises: a step of coating resin(30) with 3-18mm to woven fabrics(20a) which is made of a plastic filament yarn with 3-12mm; a step of dipping the resin by compressing the woven fabric; a step of expanding the woven fabric to the original thickness by heating the woven fabric at the resin melting temperature; a step of hardening the resin inside the woven fabric; a step of coating the resin to the cooled woven fabric; and a step of compressing the woven fabric to the desired thickness.