METAL PCB HAVING HOLE SPECULAR SURFACE AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: A metal PCB having a hole reflective surface and a method for manufacturing the same are provided to integrate a machining step of processing a metal disk having a first and second reflective structure with a coalescence step of bonding a PCB to the metal disk into a single process, thereby...

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Bibliographische Detailangaben
1. Verfasser:	JANG, JONG JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PURPOSE: A metal PCB having a hole reflective surface and a method for manufacturing the same are provided to integrate a machining step of processing a metal disk having a first and second reflective structure with a coalescence step of bonding a PCB to the metal disk into a single process, thereby simplifying manufacturing process. CONSTITUTION: A metal disk(20) has a fist reflective surface(35) which is formed at region for bonding a chip. A PCB layer(30) is stacked on the metal disk. The PCB has a hole(31), which is formed at the region for boding a chip, and a wiring pattern. A second reflective surface(32) is formed at an inner side of the PCB layer. An adhesive(34) is used for bonding the PCB layer and the metal disk. [Reference numerals] (AA) Hot press